发明名称 |
Apparatus and method for producing substrate with electrical wire thereon |
摘要 |
The apparatus and method for producing a substrate whose surface includes a metallic wire by polishing the substrate surface. A polishing liquid is supplied to a clearance between the substrate and the surface of a polishing pad. The polishing liquid includes an acid which dissolves the oxidized part of the substrate surface and is substantially free of solid abrasive powder. A relative movement is generated between the substrate surface and the polishing pad surface while the substrate surface is pressed against the polishing pad surface while the polishing liquid is supplied so that the dissolved oxidized part of the substrates surface can be removed from the substrate.
|
申请公布号 |
US6561875(B1) |
申请公布日期 |
2003.05.13 |
申请号 |
US20000558593 |
申请日期 |
2000.04.26 |
申请人 |
HITACHI, LTD. |
发明人 |
HOMMA YOSHIO;SAKUMA NORIYUKI;OHASHI NAOFUMI;IMAI TOSHINORI |
分类号 |
H01L21/304;B24B37/04;B24B49/16;B24B57/02;(IPC1-7):B24B29/00 |
主分类号 |
H01L21/304 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|