发明名称 Semiconductor memory device having a trench and a gate electrode vertically formed on a wall of the trench
摘要 A semiconductor memory device includes a trench type SRAM(Static Random Access Memory) cell having a higher integration than a stack type SRAM. The SRAM cell memory device is provided with a trench formed in a semiconductor substrate and having four side walls therein, wherein a source region and a drain region of each of first and second drive transistors are formed in two of the four side walls. A pair of active layers respectively having a source region and a drain region of a first load transistor and a second load transistor, respectively, are formed on the substrate adjacent to the side walls. A gate electrode common to the first drive transistor and the first load transistor is formed on a gate oxide film. A gate electrode of an access transistor is vertically formed in a direction vertical to the semiconductor substrate instead of being formed on the substrate for thereby decreasing an area to be occupied by the transistor.
申请公布号 US6563177(B2) 申请公布日期 2003.05.13
申请号 US19980120116 申请日期 1998.07.22
申请人 HYUNDAI ELECTRONICS INDUSTRIES CO. LTD. 发明人 KANG SEEN-SUK
分类号 G11C11/41;G11C11/412;H01L21/8244;H01L27/11;H01L29/786;(IPC1-7):H01L29/76;H01L31/036 主分类号 G11C11/41
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