发明名称 |
Semiconductor memory device having a trench and a gate electrode vertically formed on a wall of the trench |
摘要 |
A semiconductor memory device includes a trench type SRAM(Static Random Access Memory) cell having a higher integration than a stack type SRAM. The SRAM cell memory device is provided with a trench formed in a semiconductor substrate and having four side walls therein, wherein a source region and a drain region of each of first and second drive transistors are formed in two of the four side walls. A pair of active layers respectively having a source region and a drain region of a first load transistor and a second load transistor, respectively, are formed on the substrate adjacent to the side walls. A gate electrode common to the first drive transistor and the first load transistor is formed on a gate oxide film. A gate electrode of an access transistor is vertically formed in a direction vertical to the semiconductor substrate instead of being formed on the substrate for thereby decreasing an area to be occupied by the transistor.
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申请公布号 |
US6563177(B2) |
申请公布日期 |
2003.05.13 |
申请号 |
US19980120116 |
申请日期 |
1998.07.22 |
申请人 |
HYUNDAI ELECTRONICS INDUSTRIES CO. LTD. |
发明人 |
KANG SEEN-SUK |
分类号 |
G11C11/41;G11C11/412;H01L21/8244;H01L27/11;H01L29/786;(IPC1-7):H01L29/76;H01L31/036 |
主分类号 |
G11C11/41 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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