发明名称 Light emitting diode with thermally conductive structure
摘要 A light emitting diode (LED) designed to be used in conjunction with a heat sink includes an anode portion and a cathode portion formed from a thermally conductive material. The anode and cathode portions have a relatively large surface area to allow efficient heat dissipation. The cathode portion has a reflector cup formed thereon for supporting an LED chip. The LED structure allows the LED junction temperature to remain low, even as the LED chip is driven with higher currents, thereby allowing the LED to generate a higher light output without adverse temperature-related effects.
申请公布号 US6561680(B1) 申请公布日期 2003.05.13
申请号 US20000711979 申请日期 2000.11.14
申请人 SHIH KELVIN 发明人 SHIH KELVIN
分类号 H01L33/54;H01L33/64;(IPC1-7):F21V29/00 主分类号 H01L33/54
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