Lead frame for semiconductor devices, a semiconductor device made using the lead frame

摘要

A semiconductor device having a unit lead frame defining a support with a peripheral edge and a first lead spaced from the peripheral edge. The first lead has a recess formed therein. A semiconductor chip is provided on the support. A conductive element electrically connects between the semiconductor chip and the first lead. The resin layer on the semiconductor chip and the first lead extends into the recess. The invention is also directed to a unit lead frame that is part of the semiconductor device, a lead frame incorporating a plurality of unit lead frames, and a method of manufacturing semiconductor devices.