发明名称 |
Cooling apparatus for electronic devices |
摘要 |
A heat sink for removing heat from a heat source. The heat sink has at least one first surface adapted to contact at least a portion of the heat source located on a core member. At least one outer peripheral surface is located on the core member. At least one cooling fin device comprising at least one inner peripheral surface and a plurality of cooling fins are adjacent the outer peripheral surface of the core member.
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申请公布号 |
US6561261(B2) |
申请公布日期 |
2003.05.13 |
申请号 |
US20010006412 |
申请日期 |
2001.12.03 |
申请人 |
AGILENT TECHNOLOGIES, INC. |
发明人 |
WAGNER GUY R. |
分类号 |
H05K7/20;H01L23/36;H01L23/467;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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