发明名称 Wafer dicing blade consisting of multiple layers
摘要 The present invention provides a multi-layered diamond dicing blade. More particularly, the blade is a multi-layered dicing blade comprising an inner layer with a first set of diamond particles and an outer layer overlying the inner layer. The inner layer extends to the outermost periphery of the dicing blade. The outer layer comprises a second set of diamond particles having a size smaller than the first set of diamond particles.
申请公布号 US6561177(B2) 申请公布日期 2003.05.13
申请号 US20000735465 申请日期 2000.12.14
申请人 MICRON TECHNOLOGY, INC. 发明人 BALL MICHAEL B.
分类号 B23D61/02;B23D65/00;B24D5/12;B24D5/14;B28D5/02;(IPC1-7):B28D1/04 主分类号 B23D61/02
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