发明名称 |
Semiconductor laser device and wire bonding method capable of easily performing reliable wire bonding |
摘要 |
There is provided is a semiconductor laser device capable of simplifying fabricating processes with a simple construction and easily mounting two semiconductor laser elements and a monitoring PD on a compact package and a wire bonding method for the semiconductor laser device. There are provided a stem 100 provided with a plurality of lead pins 121 through 124, a sub-mount 160 that is die-bonded onto the stem 100 and has its surface formed integrally with a monitoring PD 140 and two semiconductor laser elements 131 and 132 that are die-bonded onto the sub-mount 160 and have emission light monitored by the monitoring PD 140. A first bonding surface i.e. anode electrode 183 of the monitoring PD 140 and a second bonding surface i.e. end surface 123a of a lead pin 123 that is approximately perpendicular to the first bonding surface are wire-bonded to each other.
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申请公布号 |
US6562693(B2) |
申请公布日期 |
2003.05.13 |
申请号 |
US20010803658 |
申请日期 |
2001.03.12 |
申请人 |
SHARP KABUSHIKI KAISHA |
发明人 |
ICHIKAWA HIDEKI;OKANISHI MAMORU;SANTO TERUMITSU;YOSHIDA TOSHIHIKO |
分类号 |
H01L21/60;H01S5/02;H01S5/022;H01S5/026;H01S5/40;(IPC1-7):H01L21/76 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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