LEAD FRAME STRUCTURE FOR SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a lead frame structure for semiconductor device and a method for manufacturing the same, which prevents or suppresses the generation of metal burrs when the semiconductor device is obtained through a cutting process after semiconductor elements have been mounted and encapsulated with resin. SOLUTION: The lead frame structure 101 for the semiconductor device is constituted of a metal body m and a resin film 17. The metal body m is formed with die pad portions 12 for the semiconductor elements and a plurality of leads with a signal connecting lead portion 11 being a unit. Connections are established between the die pad portions 12 of the adjacent lead frames and between the signal connecting lead portions 11 via connecting portions 18, and a connection portion is not provided for connecting the signal connection lead portions of the individual lead frames.