| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board having an inner via hole connection containing parts and an element. SOLUTION: This method of manufacturing the circuit board includes a groove forming step of forming a groove 2 into a compressible insulating substrate 1, parts arranging step of arranging the parts and element 12 mounted on a parts mounting substrate 13 in an electrically connected state in the groove 2, and a curing step of causing the insulating substrate 1 to hold the parts and element 12 by reducing the width of the groove 2 while compressing the substrate 1 by heating and pressurizing the substrate 1. In the method, a via hole forming step of filling up via holes 5 formed after a releasable film 3 is stuck to at least one surface of the substrate 1 with conductive paste 6 and, thereafter, removing the film 3 is performed in a stage before the curing step.</p> |
