WIRING BOARD, SEMICONDUCTOR DEVICE EMPLOYING IT, AND METHOD FOR PRODUCING WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To obtain a both-sided wiring board being employed in a semiconductor device handling a high frequency signal (a high frequency current) in which the high frequency characteristics are prevented from deteriorating. SOLUTION: First wiring being connected with the outer electrodes (bonding pads) of a semiconductor chip is provided on the first major surface of an insulating substrate, and second wiring connected electrically with the first wiring is provided on the second major surface of the insulating substrate facing the first major surface wherein the wiring for supplying a signal of ground potential in the second wiring spreads over the entire surface of the insulating substrate. In such a wiring board, the insulating substrate is provided with a recess in a specified region and the first wiring passes over the recess of the insulating substrate except a region being connected with the outer electrodes of the semiconductor chip and a region being connected with the second wiring.