| 摘要 |
PROBLEM TO BE SOLVED: To provide a flat circuit body which ensures reliable electrical connection between a conductor layer and an electronic apparatus, and also to provide a method of manufacturing the same. SOLUTION: An FPC 1 as a flat circuit body comprises a conductor layer 6, a first insulation layer 7, and a second insulation layer 8. The conductor 6 is formed with a hole 9. The first insulation layer 7 is formed on one surface 6a of the conductor layer 6 and is formed with a second hole 10. The second insulation layer 8 is formed on the other surface 6b of the conductor layer 6 and is formed with a third hole 11. The hole 9, the second hole 10, and the third hole 11 communicate with each other. The second hole 10 and the third hole 11 are both larger than the hole 9. The conductor layer 6 is exposed over the entire periphery of the hole 9 via the second hole 10. The conductor layer 6 is also exposed over the entire periphery of the hole 9 via the third hole 11.
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