IC SOCKET

摘要

PROBLEM TO BE SOLVED: To always keep constant contact pressure even in an IC package having different height dispersion or different height. SOLUTION: This IC socket has a pedestal having an IC package mounting part in the center; a socket body on which the pedestal is demountably mounted; a frame-shaped cover member installed movably up and down to the socket body; and a pressing mechanism holding the IC package mounted on the IC package mounting part. The pressing mechanism has a pressing member installed so as to be capable of conducting elastic displacement at the tip part of the pressing lever member.