METHOD AND DEVICE FOR FORMING FILM PATTERN, CONDUCTIVE FILM WIRING, ELECTRO-OPTICAL DEVICE, ELECTRONIC EQUIPMENT, AND NON-CONTACT CARD MEDIUM

摘要

PROBLEM TO BE SOLVED: To provide a film pattern forming method obtained by improving a film pattern forming method using an injection method and capable of efficient ly thickening a film by a simple process, satisfying the requirement for thinning, and preventing the occurrence of problems such as disconnection and a short circuit in the case of forming a conductive film. SOLUTION: In a 1st discharge process, liquid drops are discharged at a pitch larger than the diameter of a liquid drop after applying liquid drops to the whole wiring area of a board. In a 2nd discharge process, liquid drops are discharged to a position different from the discharge position of the 1st discharge process on the whole wiring forming area at the same pitch as the 1st discharge process. In a 3rd discharge process, liquid drops are discharged to the whole wiring forming area at a pitch smaller than the pitch of the 1st discharge process. The board is previously treated so that a contact angle with a liquid drop is >=60 [deg].