| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a high heat-resistant relief pattern using a positive photosensitive resin composition having excellent photosensitivity and resolution. SOLUTION: The positive photosensitive resin composition comprising (a) an alkali-soluble polyamide and (b) a photosensitive diazoquinone compound of formula (2) or (3) is prepared, exposed, developed and heated to obtain the objective cured relief pattern. In the formulae (2) and (3), Z1 and Z2 are each an aliphatic tertiary or quaternary carbon-containing organic group; M is -SO2 -, -CO- or -C(CF3 )2 -; and Q is a 1,2-naphthoquinonediazido-4 (or 5)-sulfonic ester residue or H. |
