| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition heat-developable at a lower temperature, having high dimensional stability before exposure and suitable for heat development. SOLUTION: The photosensitive resin composition comprises (A) fine copolymer particles having 80-99% toluene gel fraction, (B) a thermoplastic resin, (C) a photopolymerizable unsaturated monomer and (D) a photopolymerization initiator, wherein the sum of the masses of the fine copolymer particles (A) and the thermoplastic resin (B) accounts for 50-70 wt.% of the photosensitive resin composition and the mass of the thermoplastic resin (B) is <=1.8 time the total mass of the liquid components of the photosensitive resin composition, such as the photopolymerizable unsaturated monomer and a plasticizer. |
