发明名称 MULTILAYERED PRINTED WIRING BOARD AND ITS REGENERATING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a multilayered printed wiring board in which the electrical connection between an inner conductor layer and an outer conductor layer can be regenerated easily even when a plated layer is broken and, at the same time, the regenerating cost can be reduced. SOLUTION: This multilayered printed wiring board 1 is provided with a conductive connecting terminal 15 for regeneration which is used when the electrical connection between the outer conductor layer 5a and inner conductor layer 3a is cut by the peeling of the plated layer 9 in a blind via hole 8. The connecting terminal 15 is provided with a shaft section 16 which is inserted into the blind via hole 8 and electrically connected to the inner conductor layer 3a exposed in the hole 8 and a head section 17 which is positioned to one end of the shaft section 16 and electrically connected to the outer conductor layer 5a through the plated layer 9.</p>
申请公布号 JP2003133748(A) 申请公布日期 2003.05.09
申请号 JP20010327926 申请日期 2001.10.25
申请人 TOSHIBA CORP 发明人 AOKI KENJI
分类号 H05K3/22;H05K3/46;(IPC1-7):H05K3/46;H01R12/04 主分类号 H05K3/22
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