| 摘要 |
PROBLEM TO BE SOLVED: To provide a heater which enhances the thermal uniformity of semiconductor setting plane and prevents the exposure of a heater terminal part to the atmosphere, inside the semiconductor manufacturing apparatus and the increase in a thermal capacitance of the heater, and facilitates the installation of the heater to the semiconductor manufacturing apparatus. SOLUTION: The heater 10A has a heater 1A, having a semiconductor-setting plane 2a and a hollow support member 11, which is fixed to the back surface 2b of the heater. The long-dimension of the support member is larger than the dimension between the outer peripheral surfaces. The heater has a plate-like base part 2, a first heating element 3, made of a resistor heating element, a second heating element 4 which is made of a resistor heating element and which is controlled independently of the first heating element 3, a first terminal part 6A connected to the first heating element 3, and a second terminal part 7 connected to the second heating element 4. A first power supply means 15, connected to the first terminal part 6A, and a second power supply means 14 connected to the second terminal part 7, are housed in the inner side space 12 of the support member. The first heating element 3 and the second heating element 4 are arranged in substantially the same plane A, so as not to be connected electrically to each other.
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