| 摘要 |
The localized encapsulation is for an electronic module (23) which comprises an electronic circuit (1) such as a chip with a group of connection pads (3) laid out on a part of the active face (2) of the circuit, a support (10) with the communication interface pads (13), and assembling such module includes the following steps: physically binding the electronic circuit (1) to the support (10); electrically connecting the connection pads (3) to the communication interface pads (13) by use of conductors (16) so to leave free a part of the active surface (2) and to encapsulate each part of the active surface with pads including their vicinity. The electronic circuit (1) and the support (10) are bonded by use of a flexible adhesive having Young modulus. The electronic module comprises two groups of connection pads (3) laid out along rows in the vicinity of opposite lateral edges of the circuit, and the free part of the active face (2) extends in the central part of the circuit, or along transverse edges of the circuit. The encapsulation is of a compound chosen from polymeric materials such as epoxy resins, which are polymerized by heating or UV-radiation. A method for the manufacturing of an intelligent portable object is claimed wherein the module (23) is integrated and protected in a body of plastic material. The manufacturing equipment according to the method for assembling the electronic module comprises posts for bonding the electronic circuit to the support, for connecting the electronic circuit to the support, and for dispensing the encapsulation material by means of a syringe movable in three spatial directions and with controlled jet flow of the material. An intelligent portable object comprises the module obtained by the method and by use of the manufacturing equipment.
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