METHOD FOR FORMING CIRCUIT BY USING ULTRA SHORT PULSE LASER

摘要

PROBLEM TO BE SOLVED: To realize fine circuit formation for a three-dimensional circuit forming board without generating cracks or the like due to heat influence or the like and damaging the conductive thin film and an insulating base material. SOLUTION: The circuit forming method for the three-dimensional circuit forming board forms a circuit by forming a conductive thin film 2 consisting of a conductor on an insulating base material 1, and removing a non-circuit part 11 of the thin film 2 by using an ultra short pulse laser. High intensity ultra short pulse laser light whose pulse width is set up to an ultra short area <=pico-second is used as laser light to be used for the removal of the thin film 2.