| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component equipped with a process capable of easily and surely selecting an electronic component whose sealing is defective without increasing manufacturing processes so much at the time of manufacturing an electronic component having a sealed space. SOLUTION: At the time of manufacturing an electronic component 1 which is provided with an electronic component body 9 having an internally sealed space A and a plurality of external electrodes 7 and 8 formed on the external surface of the electronic component body 9, the electronic component main body 9 is prepared, and then the external electrodes 7 and 8 are formed by wet plating by dipping the electronic component body 9 is a plating bath, and forcedly making plating solution 11 intrude into the main body 9 whose sealing is defective, and forming the external electrodes 7 and 8 by the wet plating in the plating bath 10. Then, the defective where a plating film 12 to the sealed space is formed due to sealing failure is discriminated from any non-defective where any plating film 12 is not formed after the external electrodes 7 and 8.
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