发明名称 METHOD FOR MANUFACTURING WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board manufacturing method capable of suppressing warp in the case of collectively manufacturing a plurality of wiring boards and then individually dividing into respective wiring boards. SOLUTION: The method for manufacturing wiring boards 101 is provided with a core board arrangement process for arranging a plurality of core boards 111 in a storage part 175, in a working jig 171 having a jig surface 172 and the storage part 175 opened on the jig surface 172 and capable of storing these core boards 111 so as to align the jig surface 112 with respective core surfaces 112; and a 1st insulating layer forming process for forming a 1st resin insulating layer 131 so as to cover the jig surface 172 and respective core surfaces 112.
申请公布号 JP2003133687(A) 申请公布日期 2003.05.09
申请号 JP20010331057 申请日期 2001.10.29
申请人 NGK SPARK PLUG CO LTD 发明人 ASANO TOSHIYA;KANBE ROKURO
分类号 H05K3/42;H05K1/02;H05K3/00;(IPC1-7):H05K3/00 主分类号 H05K3/42
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