| 摘要 |
PURPOSE: To provide a package for a semiconductor device in which the mounting surface of a semiconductor element can be made flat and reduced as thin as possible in thickness, and the warpage due to the thermal expansion difference between constituting materials can be prevented. CONSTITUTION: The package 50 for the semiconductor device comprises one surface side of a multilayer substrate body 20 having conductor wirings 26, etc., formed in a multilayer via insulating resin layers 20a, etc., as a semiconductor element mounting surface having pads 24, etc., for the element connected to the electrode terminal of the element 39 to be mounted, the other surface side of the substrate body 20 formed as the external connecting terminal mounting surface having pads 33, etc., for an external connecting terminal. In this package 50, an insulating metal plat 30 insulated on the overall surface including the inner wall surfaces of through holes 28, etc., for the terminal is connected to the external connecting terminal mounting surface so as to correspond with the pads 33, etc., for the external terminal, and a frame 10 made of metal is bonded on the element mounting surface. |
