MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To improve mechanical strength of a thinned semiconductor element without increasing a manufacturing cost in a manufacturing method of a semiconductor device performing back grind processing on a rear face in a back grind process. SOLUTION: In the manufacturing method of the semiconductor device having the back grind process for back-grinding the rear face of a wafer 1 and a dicing process for dicing the wafer 1 along a prescribed dicing line after the back grind process is completed to be fragmentated into individual semiconductor elements 10, a polishing mark formation process (Figure 5(C)) for forming a polishing mark 20A in a direction (45 degree direction) different from the extension direction of the dicing line in the dicing process is provided between the back grind process and the dicing process.