SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A semiconductor device is to provide a semiconductor element(thin film transistor, a thin film diode, a photoelectric converter made of a PIN junction of a silicon or a silicon resistance element) that is thin in overall thickness and flexible(bendable) and is light. CONSTITUTION: The second adhesive material(16) of a coagulating material(an adhesive material as a representative) is filled between a substrate(third substrate) and a layer(layer 13 to be released). The second adhesive material includes an element in a mold of a flat plate-like material like the substrate without forming the element on a plastic film and is solidified. The substrate to the mold is released. The layer includes the element only by the solidified adhesive material fixed and thinned in film and is lightened.