LAMINATED SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a laminated semiconductor device which improves reliability. SOLUTION: Two or more semiconductor devices 1 having semiconductor chips 3 and substrates 2 for holding the chips 3 are mutually laminated on the substrates 2 in the thickness direction of the substrate 2. Connections 6 for ensuring electrical conduction between adjacent semiconductor devices 1 are provided on the substrates 2. All or part of the connections 6 are offset mutually between the adjacent semiconductor devices 1 on the surface of the substrate 2.