| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board that can satisfactorily package a semiconductor device that is changed into a fine pitch and a passive element. SOLUTION: The circuit board has a feedthrough conductor 2 that is provided in a circuit pattern 3 and forms a conductor layer on the inner surface of a through hole having a thickness of 0.5 mm or less. In the circuit board, the circuit pattern 3 is electrically connected to a semiconductor device and a passive element via a conductor bump 4. A first solder resist layer 5 made of at least one of Cr, Ti, Ta and their nitride is formed around the conductor bump 4 that is connected to the semiconductor device. The first solder resist layer 5 and a second solder resist layer 6 made of resin that is laminated on the first solder resist layer 5 are formed around the conductor bump 4 connected to the passive element. In the through conductor 2, the first and second solder resist layers 5 and 6 are formed successively on the conductor layer.
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