| 摘要 |
PROBLEM TO BE SOLVED: To reduce mounting space of heat radiation mechanism on a circuit board mounted on a burn-in test device with which a semiconductor integrated circuit is operated in a state that temperature stress is applied and to reduce the cost of the circuit board. SOLUTION: A sign A is a burn-in board and is constituted of a printed board 1, a metal fitting frame 2 for reinforcement, a transistor 3, a junction metal plate 4, and screws 5A, 5B, etc. The Fig. shows a part of the vicinity of rim of the burn-in board A. Many IC sockets (e.g. approx. 200 sockets) are mounted on other parts which are not shown in the Fig. and a semiconductor integrated circuit which is a physical object of a burn-in test is loaded on each IC socket. Also an auxiliary electronic circuit necessary for the burn-in test is constituted in the vicinity of the rim of the printed board 1. The transistor 3 is a constituent element of this electronic circuit and is an electronic device which needs countermeasure of the heat radiation.
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