| 摘要 |
PROBLEM TO BE SOLVED: To improve the assembling work efficiency of a semiconductor device, and to lower the impedance of the connecting part of a gate electrode and a cathode electrode to a control substrate. SOLUTION: The semiconductor device comprises a semiconductor element 1 having the gate electrode and the cathode electrode mounted on the control substrate 6. In the device, a gate electrode terminal 2 connected to the gate electrode and the cathode electrode terminal 3 connected to the cathode electrode are fixed to a connector 7 connected to a control circuit provided on the substrate, and connected. The connector has a cylindrical part.
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