| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a simple structure of a junction and capable of connecting two elements by a simple method, and to provide a method for manufacturing the same. SOLUTION: The solid-stage imaging element 10 comprises a scanning circuit 12, a photoelectric converter 14 and a connecting substrate 16. The scanning circuit 12 is constituted similar to the scanning circuit 2 of a conventional laminated solid-stage imaging element. The converter 14 is constituted similar to the photoelectric converter of a conventional hybrid solid-stage imaging element. The substrate 16 has a through-hole 48 formed through a substrate body 16a, and a signal transmitter 50 formed in the hole 48. The transmitter 50 has a signal line 52 and salient poles (bumps) 54a, 54b. The circuit 12 is electrically connected to the photoelectric converter 14 via the substrate 16.
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