发明名称 DEVICE FOR MOUNTING SEMICONDUCTOR ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor element mounting device, where a hermetically closed space is formed inside the mounting device including a work transfer passage, and various operations can be carried out, without deteriorating the antioxidant atmosphere by feeding a gas containing nitrogen to the hermetically closed space. SOLUTION: Various processes of applying a wire solder on the works 3, mounting semiconductor elements on the works 3 and unloading the works 3 from the transfer passage to house are carried out, while works 3 fed onto a transfer passage 6 by a feed station 1 are fed successively and intermittently pitch by pitch by a transfer unit 2. Furthermore, a hermetically closed space 4 is formed in a device main body 1A, a shutter 13 is moved by a cylinder 12 to open an opening 11, only when the processes of applying a wire solder on the works 3, mounting semiconductor elements on the works 3, and unloading the works 3 from the transfer passage to house are carried out, so that various processes can be carried out without deteriorating the antioxidant atmosphere.
申请公布号 JP2003133338(A) 申请公布日期 2003.05.09
申请号 JP20010322694 申请日期 2001.10.19
申请人 SANYO ELECTRIC CO LTD;SANYO HIGH TECHNOLOGY CO LTD 发明人 ICHIKAWA YOSHIO;AKAISHI KOUJI;TAKAGI MORIMICHI;OSAWA MASAAKI;SAKAI HIROSHI
分类号 H01L21/52;(IPC1-7):H01L21/52 主分类号 H01L21/52
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