| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a solar cell which can solve the conventional problem that contact resistance between a substrate and an electrode material is large and a fill factor is poor. SOLUTION: This method comprises steps of forming fine projected and recessed portions to the front surface side of a semiconductor substrate showing one conductivity type, forming a region which shows an inverse conductivity type to the front surface side of the semiconductor substrate, and forming an electrode to the front surface and rear surface sides of the semiconductor substrate. The front surface of the semiconductor substrate is coated with silver paste which is mainly formed of silver and includes silver particle of 5 to 50 pts.wt. in grain sizes ranging from 0.1 to 0.5μm for the 100 pts.wt. of silver, and is then baked.</p> |
