| 摘要 |
PROBLEM TO BE SOLVED: To seal a semiconductor chip by flame retardant epoxy sealing resin not containing halogen and red phosphorus. SOLUTION: The semiconductor chip is resin-sealed by a metal oxide, a metal hydroxide, a metal containing boric acid, an organic compound containing boric acid, an organic phosphorus compound formed into phosphate, or epoxy resin containing a silicon polymer, as a flame retarder instead of halogen, red phosphorus, and an inorganic compound. Or the semiconductor chip is resin- sealed by epoxy resin not containing any of halogen, red phosphorus, organic phosphorus compound, a metal oxide, a compound that the surface of an organic phosphorus compound is treated by a metal hydroxide, and a silicon polymer, but containing an organic compound, strong in bonding between atoms, such as a compound having a benzene ring in a principle chain, and an alicyclic compound, as a compound formed into a flame retarder. |
