发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To effectively surely remove fluid on a substrate to be processed from both sides thereof in a flat flow method. SOLUTION: When a substrate G passes through between an upper air knife 140 and a lower air knife 142, first, the upper air knife 140 blows gas upon the upper face of the substrate G obliquely from above against a transfer direction, and, a little later, the lower air knife 142 blows air upon the lower face of the substrate G obliquely from below against the transfer direction. In this manner, a fluid film of rinse fluid RU is blown together towards the rear of the substrate against surface tension, and the majority of them are dropped from the rear end of the substrate to the outside of the substrate with some parts extending around the lower face of the substrate. Then, droplets RL of the rinse fluid are collected together towards the rear end of the substrate, and nearly all of them are dropped from the rear end of the substrate to the outside of the substrate together with the parts extending from the upper face of the substrate.
申请公布号 JP2003133217(A) 申请公布日期 2003.05.09
申请号 JP20010329952 申请日期 2001.10.26
申请人 TOKYO ELECTRON LTD 发明人 SHINOZAKI MASAYA;SADA TETSUYA;NAGATA HIROSHI
分类号 G02F1/13;B65G49/06;G02F1/1333;G03F7/30;H01L21/027;(IPC1-7):H01L21/027;G02F1/133 主分类号 G02F1/13
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