| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated board for a flexible printed board which is suitable for forming fine patterns and has superior reliability, particularly superior migration-resistant properties and electrical properties such as electrical insulation properties, etc. SOLUTION: This laminated board for a flexible printed board comprises a flexible insulation film and a copper foil which is bonded to at least one side of the flexible insulation film with an adhesive layer in-between. The thermal linear expansion coefficient of the flexible insulation film is 10-20 ppm/ deg.C, the thickness of the adhesive layer is 1-15μm, the thickness of the copper foil is 3-12μm, and the surface roughness Rz of the M surface of the copper foil is 0.5-3.0μm.
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