LEAD FRAME, ITS MANUFACTURING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME

摘要

PURPOSE: To realize a partial taping without increasing a load of a taping step and decrease a warp of a frame in a method for manufacturing a lead frame which is used for a leadless package of QFN, or the like for sealing with a resin by a batch molding system in assembling the package. CONSTITUTION: An area where a plurality of semiconductor elements mounted on one surface is sealed with a resin is divided into a land-like shape, to form a board frame 11 which defines a die pad 12 and a lead 13 surrounding the die pad 12 in correspondence to each semiconductor element to be mounted in each of the divided resin sealing areas MRi. After an adhesive tape 17 is adhered to the whole other surface of the board frame 11, a cutout CP is formed in a part corresponding to an area SR between the respective resin sealing areas MRi of this adhesive tape 17.