| 摘要 |
PROBLEM TO BE SOLVED: To provide an art capable of using the narrow area, the height, and the space in a card type semiconductor device to the most, realizing a high- density mounting, and increasing the mounting effective volume. SOLUTION: In this card type semiconductor device incorporating multiple mounting substrates, when components to be mounted on the multiple mounting substrates are arranged in the order of their height, at least, 30% or more of the applicable components falling under 70% of the all when counting from the highest component are intensively mounted on a single mounting substrate. The mounting substrate A having an electrically connecting connector and the mounting substrate B having an electrical connection part are electrically connected by the electrically connecting connector and the electrical connection part. |
