| 摘要 |
<p>PROBLEM TO BE SOLVED: To secure a prescribed gap between a semiconductor element and a printed board, and to connect a semiconductor device at a low cost, even in the connection of the semiconductor device by using lead-free solder for manufacturing the semiconductor device by a batch reflow method. SOLUTION: In the manufacturing method of the semiconductor device, the semiconductor element, having multiple electrode parts, is connected with the printed board having connection parts corresponding to the electrode parts of the semiconductor element. Lead-free solder layers are disposed in the electrode parts of the semiconductor element and the connection parts of the printed board. A required amount of flux is applied to one lead-free solder layer. A part of the surfaces of the lead-free solder layers is activated and connected by the batch reflow method. Since an lead-free solder layer part, where, flux does not exist, becomes an inactive region, the connection part as a whole is prevented from being crushed, and the prescribed gap is secured between the printed board and the semiconductor element, so as to connect the device.</p> |
