发明名称 MULTILAYER SUBSTRATE MODULE AND PORTABLE WIRELESS TERMINAL
摘要 A multilayer substrate module to which an external ground node (20) supplies a reference ground potential (Vss) includes a plurality of ground lines (170-1, 170-2, 170-3), which correspond to a plurality of internal circuits (210, 220, 230), respectively. A common node (Ncmn) for joining the ground lines (170-1, 170-2, 170-3) is provided in an insulating layer (105C) in the multilayer substrate module. The common node (Ncmn) is coupled electrically to the ground node (20) through a ground pin terminal (204) shared among the internal circuits (210, 220, 230). The common node (Ncmn) is provided preferably in the lowermost insulating layer in the multilayer substrate module (120). The parasitic inductance appearing in a ground current path and shared among the internal circuits (210, 220, 230) can be decreased using fewer ground pin terminals. Therefore, the ground current path is prevented from being circuitous among the internal circuits (210, 220, 23O), resulting in stabilized operation.
申请公布号 KR20030036677(A) 申请公布日期 2003.05.09
申请号 KR20037001767 申请日期 2003.02.07
申请人 KONINKL PHILIPS ELECTRONICS NV 发明人 ROZA ENGEL
分类号 H03M1/14;H03M1/08;H03M3/00;H03M3/02 主分类号 H03M1/14
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