MULTICHIP PACKAGE AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A multichip package is provided to prevent a short-circuit problem caused by intersection of wires by connecting a part of the first bonding pads disposed in a lower chip with the second bonding pad through a metal interconnection such that the second bonding pad is disposed to be wire-bonded to the third bonding pads disposed in an upper chip. CONSTITUTION: The lower chip(100) has a plurality of the first and second bonding pads(110,120). The metal interconnection electrically connects the first bonding pad with the second bonding pad, disposed in the lower chip. The upper chip(200) is attached to the upper surface of the lower chip, including a plurality of the third bonding pads(210). The second wire(420) connects the second bonding pad with the third bonding pad.