发明名称 |
CAPACITOR ELEMENT AND ITS MANUFACTURING METHOD, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a capacitor element which can prevent film peeling in an interface between an upper electrode and a capacitor dielectric film caused by heat treatment and deterioration of capacitor characteristics, its manufacturing method and a manufacturing method of a semiconductor device having such a capacitor element. SOLUTION: A manufacturing method of a capacitor element has a process for forming a lower electrode formed of metal on a substrate, a process for forming a capacitor dielectric film formed of an oxide dielectric film on the lower electrode, a process for depositing a metallic film on a capacitor dielectric film, and a process for forming an upper electrode formed of a metallic film by patterning a metallic film. Heat treatment is carried out after deposition of a metallic film in an atmosphere containing hydrogen before patterning a metallic film. Consequently, it is possible to raise adhesion between an upper electrode and a capacitor dielectric film and to improve capacitor characteristics. |
申请公布号 |
JP2003133438(A) |
申请公布日期 |
2003.05.09 |
申请号 |
JP20010332706 |
申请日期 |
2001.10.30 |
申请人 |
FUJITSU LTD;WINBOND ELECTRON CORP;TOSHIBA CORP |
发明人 |
HAYASHI GUN;SHU SOMEI;SUZUKI HISAYA;HIEDA KATSUHIKO |
分类号 |
H01L21/28;H01L21/02;H01L21/822;H01L21/8242;H01L21/8246;H01L27/04;H01L27/105;H01L27/108 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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