| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing conductive paste allowed to be integrally baked with ceramic layers using a material containing no lead at a low temperature, and a method for manufacturing ceramic electronic parts. SOLUTION: The conductive paste is applied to the surface of a ceramic sheet containing no lead and forming a ceramic layer 11 as required conductor 12. The conductive paste obtained by mixing silver having grain size of 4.0μm, boro-silicate glass having a softening point of 540 deg.C, SiO2 , a solvent, and binder has a contraction coefficient of 15% or less at 600-700 deg.C as compared with a case of removing the solvent. The ceramic sheets on which the conductors 12 are formed are laminated to form a laminated body, which is baked at a maximum temperature of 900 deg.C. |
