| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a thin capacitor, having no resin deformation due to from hardening in molding of a sealing resin through processes easily. SOLUTION: A capacitor element locating substrate includes a first insulating layer 1, in which each exposed part of a groupe of electrode foils consisting of pairs of anode/cathode electrode foils 2, 2' located at a space of 5-100μm is an electrode extracting portion, and a second insulating layer 3, in which through holes 4, 4' are provided at joint positions between the groupe of electrode foils and anode/cathode of the capacitor elements, respectively. After a plurality of capacitors 6 are located directly on the substrate and are joined, a sealing resin layer 7 is formed, then the capacitor of large area is attained. Moreover, a capacitor of one element is attained by cutting longlwise/crosswise it with a dicing saw. The structure of the capacitor element mounted substrate is simple, the capacitors can be manufactured easily in good workability. |
