| 摘要 |
PROBLEM TO BE SOLVED: To provide a developer for photosensitive polyimides, with which polyimide patterning for interlayer insulating films for multi-layered circuit boards and forα-ray shield layers, buffer coat layers and others for semiconductor memory devices is attained within a shorter period of time than with conventional developers and with which high resolution of developed patterns is ensured. SOLUTION: The developer comprises two or more solvents including aprotic polar solvents, which are 95-85 wt.% two aprotic polar solvents having a polar component solubility parameter,δP, of their mixed solution of >=7, a dipole moment of >=3.8 and a composition ratio of 0.5-2.0 and 5-12 wt.% water, the aprotic polar solvents comprise 30-70 wt.% dimethyl sulfoxide and 30-70 wt.%γ-butyrolactone, and the weight ratio of dimethyl sulfoxide toγ-butyrolactone is 0.6-1.5. |
