SOLDERING METHOD FOR FABRICATING PTC DEVICE

摘要

PURPOSE: A soldering method for fabricating a PTC device is provided to perform the effective combination between a metal lead and a metal electrode of a conductive complex body by using a reflow soldering method. CONSTITUTION: A soldering process is performed between a metal lead and a metal electrode of a conductive complex body. A proper physical property between the metal lead and the metal electrode is maintained after the soldering process. The soldering process is performed under a processing condition of a maximum temperature condition of 180 to 250 degrees centigrade, a moving speed condition of 0.10 to 1.00 m/min, a temperature heating/cooling condition of 0.5 to 2 degrees centigrade/min. The soldering process is performed by using a heating source such as an electric heater and an infrared heater.