| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser die-bonding apparatus that has a high yield and excellent bonding accuracy in a laser chip, and can be operated at a high speed. SOLUTION: The light of a laser chip 1 where a current having an initial value I0 is supplied from an LD drive circuit 4 is detected by a photo detector through a half mirror 6, and power is measured by a power-measuring circuit 9. A CPU 3 allows the LD drive circuit 4 to increase a drive current by a variation valueΔi each from the initial value I0 . Light with specific power from the laser chip 1 is imaged by a CCD camera 7, thus stably obtaining an accurate emission image with excellent accuracy. Therefore, a stage 2 for supporting the laser chip 1 can be accurately and reliably driven, and the laser chip 1 is die-bonded with high accuracy and a high yield.
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