发明名称 HEAT DISSIPATING SHEET
摘要 PROBLEM TO BE SOLVED: To provide a heat dissipating sheet with improved peeling property, with no degraded heat dissipating property. SOLUTION: A heat dissipating sheet 10 comprises a base material 11 of silicone resin in which a heat-conductive filer is dispersed, with a surface layer 12 coated on the surface of base material 11. Related to the surface layer 12, beads 13, including either or both of glass beads and silicone resin beads, are dispersed in a silicone resin 14. The beads 13 make the surface of surface layer 12 rough, resulting in degraded or eliminated adhesion on the surface of surface layer 12. As a result, blocking caused by adhesion is prevented when the heat dissipating sheet 10 is laminated, allowing peeling sheet by sheet with no breakage. Even if a heatsink is removed while the heat dissipating sheet is interposed between a heating component and the heatsink, it is easily removed thanks to low adhesion or no adhesion on the surface of heat dissipating sheet 10.
申请公布号 JP2003133769(A) 申请公布日期 2003.05.09
申请号 JP20010330900 申请日期 2001.10.29
申请人 INOAC CORP;INOAC ELASTOMER KK 发明人 ISHIKAWA HIROMASA
分类号 H05K7/20;H01L23/373;(IPC1-7):H05K7/20 主分类号 H05K7/20
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