| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of easily locating the position of a defective area without increasing man-hours even in a semiconductor device equipped with a dummy pattern formed on a wiring layer. SOLUTION: This semiconductor device is equipped with actual wiring formed on a wiring layer on a semiconductor substrate and a dummy pattern composed of wiring pieces which have the prescribed shape and are cyclically arranged in a region where no actual wiring of the wiring layer resides. Some of the wiring pieces which are cyclically arranged are removed from the dummy pattern in accordance with a certain rule.
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