STACKED SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a stacked semiconductor device that can avoid being large in size while ensuring mounting efficiency. SOLUTION: A plurality of semiconductor chips 3 and a plurality of semiconductor devices 1 each having a substrate for holding the semiconductor chip 3, are alternately stacked in the direction of the thickness of the substrate. A connection portion 6 is provided to each of the substrates to ensure electrical conductivity between the adjacent semiconductor devices 1. At least one of the substrates is rendered to have a surface area larger than those of other substrates, and has portions 11a which jut out as compared with other substrates.