METHOD FOR FABRICATING MICRO PATTERN OF SEMICONDUCTOR DEVICE

摘要

PURPOSE: A method for fabricating a micro pattern of a semiconductor device is provided to from a micro pattern of a desired thin film on a substrate by using a simple process using a mold having a solvent absorbing force. CONSTITUTION: The mold(122) having a solvent absorbing force is prepared, including a pattern structure composed of an embossed part and an intagliated part. A thin film material having fluidity caused by a solvent is formed on the substrate(102). The solvent is reabsorbed to the thin film material. The mold is pressurized at a predetermined pressure to contact the thin film material. A part of the thin film material in contact with the embossed part of the mold pattern flows into the intagliated part of the mold pattern while the solvent contained in the thin film material is absorbed to the mold, so that the thin film material is solidified. The mold is separated from the substrate. The residual thin film material in contact with the embossed part of the mold is removed to selectively expose a part of the upper part of the substrate so that a thin film fine pattern is formed.