| 摘要 |
PROBLEM TO BE SOLVED: To suppress dimension fluctuation due to adhesion, reduce positional deviation when punching out multiple cards, have no problem of uneven printing due to deformation and wavy phenomena, pack them in a cartridge by stacking them without any clearance, and have superior card performances such as printing performance and covering performance. SOLUTION: This sheet base material for the IC card is provided with an electronic component of a prescribed thickness between a first sheet base material 1 and a second sheet base material 2 and is used for the IC card having such a structure as stacking, at least, the first sheet base material 1, the second sheet base material 2, and the electronic component together via hot melt adhesive 4. A difference between the orientation angles of the first sheet base material 1 and the second sheet base material 2 is 10 deg. or less. |
